Kopfgrafik
12.11.2019

Our client is an internationally leading telecom technology company with a strong presence in Europe and Germany. The company has a network of R&D facilities in Europe and for the facility located one hours  drive southwest of Munich we are looking for a

Test Engineer Advanced Power Module (m/f/d)

40km Southwest of Munich
Referenznummer: DETMA19143


In this position you actively support our client to set-up its first Advanced Packaging Technology R&D Group in Europe as part of a Technology expert. With your team of top experts you achieve the targets in co-operation with internal expert groups as well as with 3rd parties like top universities or industry leaders.

Your Role:

  • Verify the performance of power module prototypes through electrical (static test, dynamic test with double-pulse-method) and thermal analysis (Rth test)
  • Organize wafer level testing and built up optimal test environments together with our Engineering professionals
  • Support designing power modules to meet requirements towards thermal management, mechanical robustness, reliability, heatsink through thermal and electrical simulation
  • Prepare and manage R&D cooperation with external partners such as institutes or universities
Your Skills:
  • Master or PhD degree (or equivalent) in Physics, Electronics, Mechanical or Chemical Engineering or equivalent at University/ University of Applied Science
  • Experiences in the power semiconductor industry, mainly in (IGBT, WBG) power module testing
  • Perfect knowledge of static and dynamic testing (double pulse) including thermal test experience
  • Experiences with wafer level testing and known good die (KGD)
  • Knowledge of testing supplier and experiences in operating self-built tester
  • Good technical understanding of devices (IGBT, Si Superjunction Mosfet, SiC Mosfet, GaN)
  • Familiar with automotive quality requirements (AEC, AQG 324), reliability methodology and analysis methods for electronic packages, lifetime analysis
  • Familiar with chip (IGBT, GaN, SiC, Si) package interaction, power module bill of materials, supplier landscape
  • Fluent in English; German would be a benefit
Are you interested to learn more about this Opportunity? Then mail your application to: