Kopfgrafik
10.10.2019

Our client is an internationally leading telecom solutions provider with a strong presence in Europe and Germany. The company has a network of R&D facilities in Europe and is now expanding with a European Smart Manufacturing Facility located one hours drive southwest of Munich. This facility will develop and validate state of the art manufacturing technologies and processes for introduction in the existing production sites in Asia and Europe. The facility is part of the overall production organization of our client. 

Advanced Electronic Packaging Technology Team Leader (m/f/d)

40 km Southwest of Munich
Referenznummer: DETMA19088


In this position you actively support our client to set-up its first Advanced Packaging Technology R&D Group in Europe as part of a Technology expert. With your team of top experts you achieve the targets in co-operation with internal expert groups as well as with 3rd parties like top universities or industry leaders. Use and even improve our modern laboratories for prototyping, test, and failure analysis. 

Your role

  • Lead and develop a team of world top experts in advanced packaging, currently 15 team members and continued growth next year  
  • Scout new manufacturing process technologies and materials for advanced electronic packaging (focus on system in package SiP, chip on board CoB, millimeter wave packaging)
  • Lead advanced packaging technology sub-projects with the project team members at local site as well as at different sites and organizations, and with external partners
  • Define the advanced packaging technology roadmapping, do trend analysis
  • Develop  advanced semiconductor packaging technology processes such as die attach, chip interconnect processes
Your Skills:
  • Master or PhD degree (or equivalent) in Physics, Electronics, Mechanical or Chemical Engineering or equivalent at University/ University of Applied Science
  • Min. 7 years of experience in the semiconductor industry, mainly in backend assembly, electronic package development (ideally die attach, SMT)
  • Expertise in electronic package concepts, materials (substrate materials, encapsulation materials) and process technologies (die attach, flip chip interconnect), ideally in the millimeter wave range (for 5G), knowledge on wafer level, optical packaging, power modules is also welcome
  • Familiar with advanced package process equipment
  • Familiar with reliability methodology and analysis methods for electronic packages
  • Good technical network in the fields of electronic packaging is welcome
  • Experience and charisma in leading top experts, visionary character
  • Strong commitment to innovation, good in visualizing new ideas and concepts
  • Fluent in English; German would be a benefit
Are you interested to learn more about this Opportunity? Then mail your application to: