Kopfgrafik
27.05.2019

Our client is an internationally leading telecom solutions provider with a strong presence in Europe and Germany. The company has a network of R&D facilities in Europe and is now expanding with a European Smart Manufacturing Facility located one hours drive southwest of Munich. This facility will develop and validate state of the art manufacturing technologies and processes for introduction in the existing production sites in Asia and Europe. The facility is part of the overall production organization of our client. 

Advanced Packaging Concept and Technology Senior Engineer (m/f/d)

40 km Southwest of Munich
Referenznummer: DETMA18626


Your role:

  • Develop laser-assisted 3D MID (molded interconnect device) technologies and processes for high frequency applications
  • Scout new manufacturing process technologies and materials for electronic packages (focus on millimeter wave packages, system in package SiP)
  • Manage further advanced packaging technology sub-projects with the project team members at different sites and organizations, and with external partners
  • Conduct feasibility studies on site and with external partners, build prototypes
  • Contribute to packaging technology road-mapping, trend analysis
  • Close cooperation with internal and external partners 

Your skills:
  • Master or PhD degree (or equivalent) in Physics, Electronics, Mechanical or ChemicalEngineering or equivalent at University/ University of Applied Science
  • >5 years of experience in the semiconductor industry, mainly in backend assembly, electronic package development (ideally transfer molding, laser direct styructuring)


Your experience:
  • Expertise in high frequency electronic package concepts, encapsulation materials and process technologies (die attach, flip chip interconnect, molding, laser structuring, plating), chip-package-board interaction
  • Familiar with advanced package process equipment
  • Familiar with reliability methodology and analysis methods for electronic packages
  • Good technical network in the fields of electronic packaging
  • Strong commitment to innovation, good in visualizing new ideas and concepts
  • Fluent in English, German or Chinese is a plus